Redpine Signals is a Fabless Semiconductor and wireless systems solutions company founded in 2001 offering ultra low power and high performance products for the next generation wireless applications. Redpine was the first in the industry to launch a single stream 802.11n chipset. Subsequently, it has launched several modules and sub-systems focusing on specific vertical market segments including industrial, wireless sensor, wireless audio & video, voice over Wi-Fi and high end consumer. It has also announced the availability of multi stream 802.11n along with mobile WiMax(802.16e)and 3GPP LTE technologies.

Redpine prides in offering a complete end-to-end wireless solution leveraging its extensive patent portfolio on OFDM, MIMO and low-power techniques. The offerings include chipset, modules as well as sub-systems along with the necessary software to provide ease of integration and desired flexibility to the system integrator. This single-stop approach enables Redpine to deliver an optimal wireless solution to meet customer's requirements at an optimal price point.

TWS develops, manufactures and markets communication modules (GSM/GPRS, UMTS/HSDPA, and CDMA/EVDO) which enable machines, devices and vehicles to communicate via cellular wireless networks. The company’s core strengths are innovative products, complete control over its protocol stack and its flexible, customized solutions, which enable it to offer customers the lowest total cost of ownership and a future-proof product roadmap.

Telit is the first and, to date, only m2m module manufacturer to offer its customers a form factor and family concept. All modules in a family have the same form factors and functionality – the same size, the same shape, the same connectors and the same software interface. The advantage for users is clear; all modules in a family are interchangeable.

Toshiba America - (Ohio and W PA Territory)Electronic Components is the US division of Toshiba Corp., Japans second largest semiconductor manufacturer and the worlds ninth largest integrated manufacturer. Products include memory and flash memory-based storage solutions, a broad range of discrete devices, LCD displays, ASICS, custom SOCs, microprocessors, microcontrollers and wireless components.

TriQuint Semiconductor - Provides standard and custom product solutions including a wide variety of foundry services. Their advanced process technologies include Gallium Arsenide, Silicon Germanium, Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW).

Winbond Electronics Corporation America Designs, manufacturers, and markets memory solutions to global customers in the areas of DRAM, Mobile RAM, and Flash. Owns and operates its own 300mm fabrication facility. Offering both packaged and Known Good Die (KGD) solutions.